JPS634708B2 - - Google Patents

Info

Publication number
JPS634708B2
JPS634708B2 JP56088968A JP8896881A JPS634708B2 JP S634708 B2 JPS634708 B2 JP S634708B2 JP 56088968 A JP56088968 A JP 56088968A JP 8896881 A JP8896881 A JP 8896881A JP S634708 B2 JPS634708 B2 JP S634708B2
Authority
JP
Japan
Prior art keywords
chip carrier
substrate
board
lead
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56088968A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57204154A (en
Inventor
Katsuhiko Yabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP8896881A priority Critical patent/JPS57204154A/ja
Publication of JPS57204154A publication Critical patent/JPS57204154A/ja
Publication of JPS634708B2 publication Critical patent/JPS634708B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP8896881A 1981-06-09 1981-06-09 Structure of chip carrier Granted JPS57204154A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8896881A JPS57204154A (en) 1981-06-09 1981-06-09 Structure of chip carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8896881A JPS57204154A (en) 1981-06-09 1981-06-09 Structure of chip carrier

Publications (2)

Publication Number Publication Date
JPS57204154A JPS57204154A (en) 1982-12-14
JPS634708B2 true JPS634708B2 (en]) 1988-01-30

Family

ID=13957607

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8896881A Granted JPS57204154A (en) 1981-06-09 1981-06-09 Structure of chip carrier

Country Status (1)

Country Link
JP (1) JPS57204154A (en])

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59125642A (ja) * 1983-01-05 1984-07-20 Nec Corp リ−ドレスチツプキヤリア
JPS59125641A (ja) * 1983-01-05 1984-07-20 Nec Corp リ−ドレスチツプキヤリア
JPS629640A (ja) * 1985-07-08 1987-01-17 Nec Corp 半導体部品の実装構造
JP2826049B2 (ja) * 1992-11-18 1998-11-18 松下電子工業株式会社 半導体装置およびその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4092697A (en) * 1976-12-06 1978-05-30 International Business Machines Corporation Heat transfer mechanism for integrated circuit package
JPS55176571U (en]) * 1979-06-05 1980-12-18

Also Published As

Publication number Publication date
JPS57204154A (en) 1982-12-14

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